Home
Products
About Us
Factory Tour
Quality Control
Contact Us
Request A Quote
Home ProductsLiquid Silica Gel

Semi Conductor Liquid Silica Gel Excellent Electric Insulation / Sealing

Good quality Solar Cell Paste for sales
Good quality Solar Cell Paste for sales
The company considerate after-sales service ,And try their best to meet the requirement of customers. We will be a long-term cooperation.

—— Mr. Tehrani

Very appreciate for your professional service & higher standard quality control,very happy to work with LEED!

—— Ronaldo

We trust the quality of your products. It always the best. Keep this going, and we will establish a long-term trade relationship with you.

—— Mr. Mac Cameron

I'm Online Chat Now

Semi Conductor Liquid Silica Gel Excellent Electric Insulation / Sealing

China Semi Conductor Liquid Silica Gel Excellent Electric Insulation / Sealing supplier

Large Image :  Semi Conductor Liquid Silica Gel Excellent Electric Insulation / Sealing

Product Details:

Place of Origin: China
Brand Name: LEED-INK
Certification: ISO9001, ISO14001, SGS, ROHS
Model Number: EG-N050T

Payment & Shipping Terms:

Minimum Order Quantity: 1KG
Price: Negotiable
Packaging Details: 1KG/Plastic jar, 5KGS/Plastic bucket, and 25KGS/Plastic bucket. Can be customized.
Delivery Time: within 7 days after payment confirmed
Payment Terms: L/C, T/T, Western Union, Paypal
Supply Ability: 5000000KG per month
Detailed Product Description
Color: Colorless, Transparent Mixing Ratio: 1:1
Viscosity: 500 (adjustable) Surface Drying Time(h): 4
Curing Time (h): 25℃/24h, Or 90℃/1.2h Breakdown Voltage(kV/mm): 11
Thixotropic Index(0.1mm): 381 Operating Temperature (℃): -40℃-200℃

 

Excellent Electric Insulation and Sealing Liquid Silicone Gel for Semi Conductor and IGBT

 

 

Description

 

LEED-INK silica gel EG-N050T is delivered as two component low viscous liquids, which once mixed and cured,transforms into a transparent coloured,solid, elastic,self rebound and resistant material. Polymerisation occurs without formation of heat.

The cured gel is used to isolate moisture and other noxious pollutant from contacting the circuit board, also used as dielectric of high voltage. The other usage is stress relief for protecting circuit and components from high temperature and mechanical stress

 

 

Applications

 

The silica gel is widely used inapplications which requires well protect against moisture,dust, and have excellent insulating property for electronic components.It could be used for Internal coating material in transistor and intergrated circuit,trasparent power pouring material and plastic adhesive in optical device.

 

Advantage

 

  • 1:1 addition type

  • Superior elasticity for stress relief

  • Quite low oil penetration after cured, good anti-poisoning

  • Good dielectric in high temperature, protect from high voltage

  • Excellent age resistance and weather resistance

  • Excellent waterproof, corrosion prevention, moisture proof and chemical media resistance

 

 

Specification

 

Test Properties
EG-N050T
Color A B A+B
Colorless, transparent Colorless, transparent Colorless, transparent
Mixing Ratio 1:1
Color Transparent

Viscosity (mPa.S)

(Brookfield HBT,10rpm,25℃)

500 (adjustable)
Density (g/cm3) 0.96
Thermal Conductivity (W/m.K) 0.2
Surface Drying Time(h) 4
Curing Time (h) 25℃/24h, or 90℃/1.2h
Volume Resistance (Ω·cm) 1×1014
Breakdown Voltage(kV/mm) 11
Thixotropic Index(0.1mm) 381
Operating Temperature (℃) -40℃-200℃

 

 

 

Usage

 

1) Component A and component B should use special tools separately. Do not use the tools in mixture.

2) Separately stir component A and component B fully and evenly before using.

3) Mix according to A:B=1:1, and stir it over 15min to ensure the mixing uniformity of component A and B.

4) After mixing, deaerate the paste in vacuum equipment with 10min before potting. To ensure the potting quality, it is recommended to deaerate again after potting.

5) Please finish 3) and 4) within operating time(1-2h).

6) Curing could be done by 90℃/1.2h, or 24h in room temperature.

 

 

Package

 

The general package is 1KG/Plastic jar, 5KGS/Plastic bucket, and 25KGS/Plastic bucket.

 

 

Why Choose Us?

 

1. LEED-INK has a deep know-how and a strengthened experience linked to the development, production and use of thermal conductive materials for a great variety of applications.


2. R&D Team takes over 20% of company employees, which enables professional R&D team technical service.


3. Customiszed production for different paste electrical properties requirements.


4. Strict QC, High quality control.


5. Small MOQ 50KG can be accepted.


6. Fast & prompt delivery (Within 7 days )

 

7. OEM/ODM Available.

 

 

FAQ

 

Q1: What is the main application about it?

A: Encapsulating and protecting the power module, or other electronic components.

 

Q2: Are you trade company or manufacturer?
A:
We are China professional manufacturer of customizing various thermal interface materials such as silicone thermal conductive compound, silicone potting materials, liquid silica gel for more than15 years experience in this line.

 

Q3: Can i get sample?
A:
Yes,we are honored to provide you sample. 1~2PCS and 50~100ML/PCS ,Free sample and Customer bear the freight.

 

Q4: What payment term is available?
A:
We can accept Paypal, TT, Western Union.

Q5: What's the lead time?
A:
1~3days for sample ,5~7workdays for mass order.

 

Q6: What should I do if the product has some mistake during the using process?
A:
We have perfect after-sales service with experienced technical team. Any questions, you can contact with us directly, technical members can help solve the problem.

Contact Details
Hunan LEED Electronic Ink Co., Ltd

Send your inquiry directly to us (0 / 3000)