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Silicone Electronic Potting Compound , Excellent Potting Compound For Pcb

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Silicone Electronic Potting Compound , Excellent Potting Compound For Pcb

China Silicone Electronic Potting Compound , Excellent Potting Compound For Pcb supplier

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Product Details:

Place of Origin: China
Brand Name: LEED-INK
Certification: ISO9001, ISO14001, SGS, ROHS
Model Number: EG-FXXX series

Payment & Shipping Terms:

Minimum Order Quantity: 1KG
Price: Negotiable
Packaging Details: 1KG/Plastic can, 5KGS/Plastic bucket, and 25KGS/Plastic bucket
Delivery Time: within 7 days after payment confirmed
Payment Terms: L/C, T/T, Western Union, Paypal
Supply Ability: 500000KG per month
Detailed Product Description
Mixing Ratio: 1:1 Color: Red
Heating Curing Time (h): 100℃/15min Operating Temperature (℃): -50℃-250℃
Thermal Conductivity (W/m.K): 0.8 / 2.6 Room Temperature Curing Time (h): 24H
Hardness (shore A): 42-60


Excellent High & Low Temperature Resistance Two Component Silicone Potting Compound



LEED-INK two-part thermally conductive silicone encapsulant and potting compound for electronics is manactured by full-automatic producrtion line.

It has the properties of thermal shock resistance,excellent electric properties,and low water absorption.They have deep hardening performance,and high bond strength to coherer,alloy,ceramic,glass or plastic surfaces.


  • Two-part; thermally conductive, room temperature or heat cure
  • Minimal shrinkage
  • No exotherm during cure
  • No solvents or cure by-products; deep section cure
  • Good dielectric properties
  • Cures to a flexible elastomer



Test Properties
EG-F026R EG-F008G
Mixing Ratio 1:1 1:1
Color A B A+B A B A+B
White Red Red White Black Gray

Viscosity (Pa.S)

(Brookfield HBT,10rpm,25℃)

80 40 60 3.5 4 4

Room Temperature
Operable Time (h)

>8h >4h

Room Temperature
Curing Time (h)

24 24
Heating Curing Time (h) 100℃/15min 100℃/15min
Density (g/cm3) 2.54 1.50
Hardness (shore A) 60 42
Operating Temperature (℃) -50℃-250℃ -50℃-250℃
Thermal Conductivity (W/m.K) 2.60 0.80
Volume Resistance (Ω·cm) 1014 1014


1) Component A and component B should use special tools separately. Do not use the tools in mixture.
2) Separately stir component A and component B fully and evenly before using.
3) Mix according to A:B=1:1, and stir it over 15min to ensure the mixing uniformity of component A and B.
4) After mixing, deaerate the paste in vacuum equipment with 10min before potting. To ensure the potting quality, it is recommended to deaerate again after potting. If no deaeration, please put the product with 30min in room temperature before heating and curing.
5) Please finish 3) and 4) within operating time(8h).
6) Curing could be done by 80℃/15min, or 24h in room temperature.
The general package is 1KG/Plastic can, 5KGS/Plastic bucket, and 25KGS/Plastic bucket.
Why Choose Us?
1. LEED-INK has a deep know-how and a strengthened experience linked to the development, production and use of thermal conductive materials for a great variety of applications.
2. Ensure product with high quality and pre-commissioning before delivery.
3. Fastest delivery: Sample order in stock and 3-7 days for mass production.
4. Dedicated to high quality, stable supply and considerate service.

5. Accept low order quantity. Easy to make a test for all customers.



Q1: Are you trade company or manufacturer?
We are China professional manufacturer of customizing various thermal interface materials for years experience in this line.


Q2: Can you provide OEM or ODM service?
Surely we can. We have a professional team which has rich experience in silicone sealant field. You can also design your logo,packaging and other details.If the existing products can meet your requirements, we can provide you with customized service.


Q3: Can i take sample?
Yes,we are honored to provide you sample. 1~2PCS and 50~100ML/PCS ,Free sample and Customer bear the freight.


Q4: What payment term is available?
We can accept Paypal, TT, Western Union.


Q5: What's the lead time?
1~3 days for sample ,5~7 workdays for mass order.

Contact Details
Hunan LEED Electronic Ink Co., Ltd

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