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Chip Component Electrical Conducting Paste , Non Toxic Thermal Conducting Paste

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Chip Component Electrical Conducting Paste , Non Toxic Thermal Conducting Paste

China Chip Component Electrical Conducting Paste , Non Toxic Thermal Conducting Paste supplier

Large Image :  Chip Component Electrical Conducting Paste , Non Toxic Thermal Conducting Paste

Product Details:

Place of Origin: CHINA
Brand Name: LEED-INK
Certification: ISO9001, ISO14001, ROHS
Model Number: DT8503

Payment & Shipping Terms:

Minimum Order Quantity: 1KG
Price: Negociatable
Packaging Details: 1 KG/ barrel, 6 barrels/ Carton. Carton Size: 39*26*17cm, G.W.: 7.5KG
Delivery Time: Within 7 days after payment confirmed
Payment Terms: L/C, T/T, Western Union
Supply Ability: 5000KG/Month
Detailed Product Description
Application: Chip Component, Ozonator Drying: 150℃-150℃-150℃ -120℃/200(mm/min)
Firing: 850℃/10-12min Sheet Resistance (mΩ/sq): ≤ 4
Welderability: The Tin Area ≥95% Solder Resistance (times) (260±5℃, 10s/time, Sn96.5Ag3Cu0.5 Solder): ≥1
Adhesion (N/2×2mm2): ≥30

 

Good Ageing Resistance 850 ℃ Fired Electrically Conductive Paste for Chip Component

 

 

Description

 

DT8503 is a high-temperature sintered conductive paste. It is non-toxic element up to European RoHS environmental regulation (2002/95/EC). It is designed on various ceramic thick film circuits, GPS dielectric rod antennas, Thick film heaters, chip component, ozonator, etc.

LEED-INK has formed an international R&D team with rich industry experience. Led by foreign experts, help customers improve the quality of products by leading technology products and self-built professional technical service team. And we have a full range of products, which can provide one-stop service to reduce procurement costs for customers.

 

 

Application

 

  • Ceramic Thick Film Circuits
  • GPS Dielectric Rod Antennas
  • Thick Film Heaters
  • Chip Component
  • Ozonator

 

Specification

 

Test

Properties of DT8503

Viscosity (Pa.S) (NDJ-99, 4#, 10rpm, 25±0.5℃)

90-370
Fineness (μm) ≤12

Screen Mesh (Stainless steel/ Polyester mesh)

250~325

Recommended Drying Conditions

150℃-150℃-150℃-120℃/200(mm/min)

Recommended Firing Conditions

850℃/10-12min
Sheet Resistance (mΩ/sq) (@12μm fired thickness) ≤ 4

Welderability

(235±5℃, 10s/time; Sn96.5Ag3Cu0.5 solder)

The tin Area ≥95%

Solder Resistance (times)

(260±5℃, 10s/time, Sn96.5Ag3Cu0.5 solder)

≥1
Adhesion ((N/2×2mm2) ≥30
Shelf Life

Six Months from Date of Shipme

 

 

Advantage

 

1. Strong Adhesion

2. Good Solderability

3. Excellent Ageing Resistance

4. Good Conductivity

 

Package

 

Our standard packing is: 1KG/Barrel, 6 Barrels/Carton. Carton size: 39*26*17cm.
If you need customized packing, pls contact us for details.

 

FAQ

 

1. When can I get quotation for my inquiry?
Usually within 24 hours!

 

2. How long have your company run on electronic paste?
Over 15 years focusing on electronic paste field, 5 years exporting experience.

 

3. What’s your delivery time?
A:We will make delivery within 3 to 7 days after payment confirmed (Chinese holiday are not included).

 

4.Can I get a sample?
A: Yes, sample is available. If noble metal such as Ag, Pd included, and the material cost is already high, we do not offer free samples.

 

5. What payment terms is acceptable to you?
T/T, Western Union, Paypal, and L/C.

 

6. How do you treat quality complaint?
A:First of all, our QC department will do strict examination of our export products in order to reduce the quality problem to near zero. If there is a real quality problem caused by us, we will undertake all the expense of replacement.

 

 

Related Products Properties

 

Test Properties
DT8501 DT8502 DT8504

Viscosity (Pa.S)

(NDJ-99, 4#, 10rpm, 25±0.5℃)

90-370
Fineness (μm) ≤12

Screen Mesh

(Stainless steel/ Polyester Mesh)

250~325
Leveling Time At room temperature, 2-3 min

Recommended

Drying Conditions

150℃-150℃-150℃-120℃/200(mm/min)

Recommended

Firing Conditions

850℃/10-12min
Sheet Resistance (mΩ/sq) (@12μm fired thickness) ≤ 2.5 ≤ 3 ≤ 5
Welderability (235±5℃, 10s/time; Sn96.5Ag3Cu0.5 solder) The tin Area ≥95%

Solder Resistance (times)

(260±5℃, 10s/time, Sn96.5Ag3Cu0.5 solder)

≥1
Adhesion (N/2×2mm2) ≥30
Shelf Life Six Months from Date of Shipment

Contact Details
Hunan LEED Electronic Ink Co., Ltd

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