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Good Solderability Electrically Conductive Paste For ALN Electrode

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Good Solderability Electrically Conductive Paste For ALN Electrode

China Good Solderability Electrically Conductive Paste For ALN Electrode supplier

Large Image :  Good Solderability Electrically Conductive Paste For ALN Electrode

Product Details:

Place of Origin: CHINA
Brand Name: LEED-INK
Certification: ISO9001, ISO14001, ROHS
Model Number: DT8502

Payment & Shipping Terms:

Minimum Order Quantity: 1KG
Price: Negociatable
Packaging Details: 1 KG/ barrel, 6 barrels/ Carton. Carton Size: 39*26*17cm, G.W.: 7.5KG
Delivery Time: Within 7 days after payment confirmed
Payment Terms: L/C, T/T, Western Union
Supply Ability: 5000KG/Month
Detailed Product Description
Application: ALN Electrode Drying: 150℃-150℃-150℃ -120℃/200(mm/min)
Firing: 850℃/10-12min Welderability: The Tin Area ≥95%
Adhesion (N/2×2mm2): ≥30 Sheet Resistance (mΩ/sq) (@12μm Fired Thickness): ≤ 3
Shelf Life: 6 Months

 

Good solderability 850 ℃ Fired Electrically Conductive Paste for ALN Electrode

 

 

Description

 

Our pastes DT8502 is an environmentally friendly product created as a substitute to lead solder. They have the highest level of thermal conductivity in the industry for high-density silver filling, as well as also possessing high electrical conductivity. Therefore, it has been favored by many customers since its development.

 

Advantage

 

1. High adhesiveness reliability with various types of ceramic substrates
2. Offers migration resistance and can be UL796 certified
3. Includes no Pd and offers superior anti sulfuration

 

Application

 

  • Piezoelectric Ceramics
  • Aluminium nitride substrate
  • Piezoelectric crystal electrode(Buzzer,Transducer,Piezoelectric ceramics
  • Chip Component
  • ALN (aluminium nitride) electrode

 

Specification

 

Test

Properties of DT8502

Viscosity (Pa.S) (NDJ-99, 4#, 10rpm, 25±0.5℃)

90-370
Fineness (μm) ≤12

Screen Mesh (Stainless steel/ Polyester mesh)

250~325

Recommended Drying Conditions

150℃-150℃-150℃-120℃/200(mm/min)

Recommended Firing Conditions

850℃/10-12min
Sheet Resistance (mΩ/sq) (@12μm fired thickness) ≤ 3

Welderability

(235±5℃, 10s/time; Sn96.5Ag3Cu0.5 solder)

The tin Area ≥95%

Solder Resistance (times)

(260±5℃, 10s/time, Sn96.5Ag3Cu0.5 solder)

≥1
Adhesion ((N/2×2mm2) ≥30
Shelf Life

Six Months from Date of Shipme

 

 

Package

 

Our standard packing is: 1KG/Barrel, 6 Barrels/Carton. Carton size: 39*26*17cm.
If you need customized packing, pls contact us for details.

 

Why Choose Us?

 

1. We has over 15 years’ manufacturing experience in electronic paste product and 5 years of exporting experience. Our professionaland thoughtful after-sales service eliminates your worries.

 

2. All member in R&D Team with well-educated, and with professional electronic paste research background.

 

3. Regularly train the first-line operators for the paste products knowledge and the operation skills.

 

4. Dedicated to high quality, stable supply and considerate service.

 

5. To inform customers of price trends in the market timely.

 

6. Customiszed production for different paste electrical properties requirements.

 

 

Related Products Properties

 

Test Properties
DT8501 DT8503 DT8504

Viscosity (Pa.S)

(NDJ-99, 4#, 10rpm, 25±0.5℃)

90-370
Fineness (μm) ≤12

Screen Mesh

(Stainless steel/ Polyester Mesh)

250~325
Leveling Time At room temperature, 2-3 min

Recommended

Drying Conditions

150℃-150℃-150℃-120℃/200(mm/min)

Recommended

Firing Conditions

850℃/10-12min
Sheet Resistance (mΩ/sq) (@12μm fired thickness) ≤ 2.5 ≤ 4 ≤ 5
Welderability (235±5℃, 10s/time; Sn96.5Ag3Cu0.5 solder) The tin Area ≥95%

Solder Resistance (times)

(260±5℃, 10s/time, Sn96.5Ag3Cu0.5 solder)

≥1
Adhesion (N/2×2mm2) ≥30
Shelf Life Six Months from Date of Shipment

Contact Details
Hunan LEED Electronic Ink Co., Ltd

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