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| Product Name: | Electrically Conductive Paste | Application: | Piezoelectric Ceramic |
|---|---|---|---|
| Viscosity (Pa.S): | 90-370 | Drying: | 150℃-150℃-150℃ -120℃/200(mm/min) |
| Firing: | 850℃/10-12min | Sheet Resistance (mΩ/sq): | ≤ 2.5-5 |
| Welderability: | The Tin Area ≥95% | Solder Resistance (times): | ≥1 |
850 DegreeC Fired Electrically Conductive Paste for Piezoelectric Ceramic
Description
DT850X series is a high-temperature sintered conductive paste. It is non-toxic element up to European RoHS environmental regulation (2002/95/EC). It is designed on various ceramic thick film circuits, GPS dielectric rod antennas, Thick film heaters, chip component, ozonator, etc.
Application
Specification
|
Test |
Properties of DT850X Series |
|
Viscosity (Pa.S) (NDJ-99, 4#, 10rpm, 25±0.5℃) |
90-370 |
| Fineness (μm) | ≤12 |
|
Screen Mesh (Stainless steel/ Polyester mesh) |
250~325 |
|
Recommended Drying Conditions |
150℃-150℃-150℃-120℃/200(mm/min) |
|
Recommended Firing Conditions |
850℃/10-12min |
| Sheet Resistance (mΩ/sq) (@12μm fired thickness) | ≤ 2.5-5 |
|
Welderability (235±5℃, 10s/time; Sn96.5Ag3Cu0.5 solder) |
The tin Area ≥95% |
|
Solder Resistance (times) (260±5℃, 10s/time, Sn96.5Ag3Cu0.5 solder) |
≥1 |
| Adhesion ((N/2×2mm2) | ≥30 |
| Shelf Life |
Six Months from Date of Shipme |
Advantage
1. Wide variety of Ag/Pd powder
(Alloy, coprecipitated and mixed powders)
2. Highly heat-resistant type (alloy) with good film coverage ratio
3. Good adhesiveness
4. Fills well
Package
Our standard packing is: 1KG/Barrel, 6 Barrels/Carton. Carton size: 39*26*17cm.
If you need customized packing, pls contact us for details.
Why Choose Us?
1. High-quality products and the most reasonable price.
2. Superior testing equipment, simulate clients’ real feel, ensure every products meet customersreal production requirement.
3. Dedicated to high quality, stable supply and considerate service.
4. Fast delivery: quick supply of sample in stock and 3-7 days for bulk production.
5. Provide considerate services to minimize clients’ worries.
Related Products Properties
| Test | Properties | |||
| DT8501 | DT8502 | DT8503 | DT8504 | |
|
Viscosity (Pa.S) (NDJ-99, 4#, 10rpm, 25±0.5℃) |
90-370 | |||
| Fineness (μm) | ≤12 | |||
|
Screen Mesh (Stainless steel/ Polyester Mesh) |
250~325 | |||
| Leveling Time | At room temperature, 2-3 min | |||
|
Recommended Drying Conditions |
150℃-150℃-150℃-120℃/200(mm/min) | |||
|
Recommended Firing Conditions |
850℃/10-12min | |||
| Sheet Resistance (mΩ/sq) (@12μm fired thickness) | ≤ 2.5 | ≤ 3 | ≤ 4 | ≤ 5 |
| Welderability (235±5℃, 10s/time; Sn96.5Ag3Cu0.5 solder) | The tin Area ≥95% | |||
|
Solder Resistance (times) (260±5℃, 10s/time, Sn96.5Ag3Cu0.5 solder) |
≥1 | |||
| Adhesion (N/2×2mm2) | ≥30 | |||
| Shelf Life | Six Months from Date of Shipment | |||
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