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Low Resistance Silver Electrically Conductive Paste 250 - 325 Screen Mesh

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Low Resistance Silver Electrically Conductive Paste 250 - 325 Screen Mesh

China Low Resistance Silver Electrically Conductive Paste 250 - 325 Screen Mesh supplier

Large Image :  Low Resistance Silver Electrically Conductive Paste 250 - 325 Screen Mesh

Product Details:

Place of Origin: China
Brand Name: LEED-INK
Certification: ISO9001, ISO14001, SGS, ROHS
Model Number: DT5504

Payment & Shipping Terms:

Minimum Order Quantity: 1KG
Price: Negotiable
Packaging Details: 1KG/ Plastic Jar, 6 Jars/ Carton. Carton size: 39*26*17cm. G.W.: 7.5KG / carton
Delivery Time: within 7 days after payment confirmed
Payment Terms: L/C, T/T, Western Union, Paypal
Supply Ability: 30000KG per month
Detailed Product Description
Ag Content (%): 65 Drying: 120-150℃/ >8min
Firing: 550℃/>10min Conductivity(mΩ/sq): ≤4
Solder Resistance (times) (235°C, 10s, PbSn Solder): ≥2 Adhesion((N/2×2mm2): ≥20
Screen Mesh (Stainless Steel/ Polyester Mesh): 250~325

 

Low Resistance Silver Electrically Conductive Paste for Chip Component

 

 

Description

 

The silver paste DT5504 is 65% Ag content silver electrically conductive paste for applications such as chip component with a lower firing temperature, usually in the 500-550 ℃ can be fired for the need for lower sintering temperature of the circuit, the sensor and electronic components electrode.

It has excellent electrical conductivity, reliable adhesion, in line with the latest environmental requirements with non-toxic substance.

 

Application

 

It could be applied for various circuit boards, chip component electrodes, LED packages, thermoelectric modules, boards for power control modules, etc.

 

Advantage

  • Strong Adhesion
  • Good Solderability
  • Excellent Ageing Resistance
  • Good Conductivity
  • Pb and Cd free

Specification

 

Test

 

DT5504

 

Ag Content (%)

65

Viscosity (Pa.S)

(NDJ-99, 4#, 10rpm, 25±0.5℃)

200±30

Fineness(μm)

<12

Screen Mesh

(Stainless steel/ Polyester mesh)

250~325

Recommended Drying Conditions

120-150℃/ >8min

Recommended Firing Conditions

550℃/ >10min

Fired Thickness(μm)

14±2

Conductivity(mΩ/sq)

≤4

Welderability

Good

Solder Resistance (times)

(235°C, 10s, PbSn Solder)

≥2

Adhesion/ Tape Pull

(3M Scotch Tape #600)

No Ag Transfer

Adhesion((N/2×2mm2)

≥20

Thinner

LEED DZ-XS

Shelf Life

Six Months

from Date of Shipment

 

 

Why Choose Us?

 

LEED-INK has been specialized in development, production and sales of electronic paste for more than ten years. The company Strives to develop green, energy saving and excellent products to practice corporate value.


We have formed an international R&D team with rich industry experience. Led by foreign experts, help customers improve the quality of products by leading technology products and self-built professional technical service team. And we have a full range of products, which can provide one-stop service to reduce procurement costs for customers.

 

 

Related Products Properties

 

Test

 

Properties

 

 

DT5501

 

 

DT5502

 

 

DT5503

 

 

DT5504

 

 

DT5505

 

Ag Content (%)

80 75 70 65 60

Viscosity (Pa.S)

(NDJ-99, 4#, 10rpm, 25±0.5℃)

200±30

Fineness(μm)

<12

Screen Mesh

(Stainless steel/ Polyester Mesh)

250~325

Leveling Time

At room temperature, 2-3 min

Recommended

Drying Conditions

120℃-150℃/>8min

Recommended

Firing Conditions

550℃/>10min

Film Thickness (μm)

12-16

Conductivity (mΩ/sq)

≤ 3

≤ 3

≤ 4

≤ 4

≤ 5

Welderability

Excellent

Excellent

Good

Good

Good

Soldering Resistance (times)

(235℃, 10s, PbSn Solder)

≥2

Adhesion((N/2×2mm2)

≥20

Shelf Life200±30

Six Months from Date of Shipment

Contact Details
Hunan LEED Electronic Ink Co., Ltd

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