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Home ProductsLow Temperature Silver Paste

58% - 68% Solid Content Silver Conductive Adhesive Paste 0.5 - 10 Pa.S Viscosity

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58% - 68% Solid Content Silver Conductive Adhesive Paste 0.5 - 10 Pa.S Viscosity

China 58% - 68% Solid Content Silver Conductive Adhesive Paste 0.5 - 10 Pa.S Viscosity supplier

Large Image :  58% - 68% Solid Content Silver Conductive Adhesive Paste 0.5 - 10 Pa.S Viscosity

Product Details:

Place of Origin: China
Brand Name: LEED-INK
Certification: ISO9001, ISO14001, SGS, ROHS
Model Number: DT1203

Payment & Shipping Terms:

Minimum Order Quantity: 1KG
Price: Negotiable
Packaging Details: 1KG/ Plastic Jar, 6 Jars/ Carton. Carton size: 39*26*17cm. G.W.: 7.5KG/ Carton
Delivery Time: Within 7 days after payment confirmed
Payment Terms: L/C, T/T, Western Union, Paypal
Detailed Product Description
Solid Content (%): 58-68 Drying: 130℃/30min Plus 180℃/30min
Adhesion/ Tape Pull (3M Scotch Tape #600): No Ag Transfer Solderability: Dip Soldering Area: >90%
Dip Soldering Condition: Sn92 Ag 3.5cu0.5 (230℃-240℃, 1-5min) Volume Resistivity: <2.4×10-4Ω·cm

 

High Electrically Conductivity 120 Degree C Curing Low Temperature Silver Paste

for Tantalum Capacitors

 

 

Description

 

LEED-INK silver conductive paste DT1203 is a general purpose coating suitable for direct application to most substrates including plastics and it is special suitable for tantalum capacitors applications. It is non-toxic element up to European RoHS environmental regulation (2002/95/EC).

It has features of high electrically conductivity, good adhesion, excellent solder resistance, , low consumption, etc.

 

Application

 

The low temperature curing conductive silver paste refers to the silver paste with curing temperature of 100-200℃. The silver paste DT1203 is mainly developed for capacitors including tantalum electrolytic capacitors and aluminum electrolytic capacitors.

It is designed to exhibit high conductivity, good adhesion and excellent solder resistance purposes.

 

Specification

 

Test Properties

Viscosity (Pa.S)

(10rpm, 25℃, 2min)

0.5-10
Solid Content 63±5%
Drying Temperature & Time 130℃/30min + 180℃/30min
Dip Soldering Condition

Sn92 Ag 3.5cu0.5

230℃-240℃ 1-5min

Solderability Dip Soldering Area: >90%
Volume Resistivity <2.4×10-4Ω·cm
Adhesion 3M #600 Tape *1min, vertical pull, no Ag Transfer
Hardness ≥2H
Shelf Life

Six Months

from Date of Shipment

 

Feature Advantage

 

1. High Electronic Conductivity

The low temperature curing silver paste is with high electrical conductivity, and the volume resistance could be controlled under 2.4×10-4Ω·cm.

 

2. Low heat-drying temperature

The low temperature curing conductive silver paste refers to the silver paste with drying temperature of 100-200℃. And LEED-INK silver paste DT1203 is suggested drying process of 130℃/30min plus 180℃/30min.

 

3. Good adhesion

The tantalum capacitor using silver paste DT1203 is with good adhesion. Stick the printing surface with 3M tape and then quickly vertically pulled off, no Ag transfer.

 

4. Excellent Solder Resistance

The silver paste DT1203 exhibits excellent solder resistance, and the dip soldering area is up to 90%.

 

5. Environmental friendly, up to RoHS regulation

The low temperature silver paste contains no toxic materials and heavy metal ions such as lead, Cadmium, nickel, and it is environmental friendly and meet environmental standard of RoHS regulation

Contact Details
Hunan LEED Electronic Ink Co., Ltd

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