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Solder Resistant Silver Thermal Paste , ISO14001 Low Consumption Ag Paste

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Solder Resistant Silver Thermal Paste , ISO14001 Low Consumption Ag Paste

China Solder Resistant Silver Thermal Paste , ISO14001 Low Consumption Ag Paste supplier

Large Image :  Solder Resistant Silver Thermal Paste , ISO14001 Low Consumption Ag Paste

Product Details:

Place of Origin: China
Brand Name: LEED-INK
Certification: ISO9001, ISO14001, SGS, ROHS
Model Number: DT1203

Payment & Shipping Terms:

Minimum Order Quantity: 1KG
Price: Negotiable
Packaging Details: 1KG/ Plastic Jar, 6 Jars/ Carton. Carton size: 39*26*17cm. G.W.: 7.5KG/ Carton
Delivery Time: Within 7 days after payment confirmed
Payment Terms: L/C, T/T, Western Union, Paypal
Detailed Product Description
Solid Content (%): 58-68 Drying: 130℃/30min + 180℃/30min
Adhesion/ Tape Pull (3M Scotch Tape #600): No Ag Transfer Pencil Hardness(H): ≥2
Solderability: Dip Soldering Area: >90% Dip Soldering Condition: Sn92 Ag 3.5cu0.5 (230℃-240℃, 1-5min)
Volume Resistivity: <2.4×10-4Ω·cm


Good Solder Resistance Low consumption Low Temperature Silver Paste

for Tantalum Electrolytic Capacitors





LEED-INK silver conductive paste DT1203 is a general purpose coating suitable for direct application to most substrates including plastics and it is special suitable for tantalum capacitors applications. It is non-toxic element up to European RoHS environmental regulation (2002/95/EC).

It has features of good solder resistance, high electrically conductivity, low consumption, high heat-resistance, etc.




The low temperature curing conductive silver paste refers to the silver paste with curing temperature of 100-200℃. The silver paste DT1203 is mainly developed for capacitors including tantalum electrolytic capacitors and aluminum electrolytic capacitors.

It is designed to exhibit good solder resistance and low consumption purposes.




Test Properties

Viscosity (Pa.S)

(10rpm, 25℃, 2min)

Solid Content 63±5%
Drying Temperature & Time 130℃/30min + 180℃/30min
Dip Soldering Condition

Sn92 Ag 3.5cu0.5

230℃-240℃ 1-5min

Solderability Dip Soldering Area: >90%
Volume Resistivity <2.4×10-4Ω·cm
Adhesion 3M #600 Tape *1min, vertical pull, no Ag Transfer
Hardness ≥2H
Shelf Life

Six Months

from Date of Shipment


Feature Advantage


1. High Electronic Conductivity

The low temperature curing silver paste is with high electrical conductivity, and the volume resistance could be controlled under 2.4×10-4Ω·cm.


2. Excellent Solder Resistance

The silver paste DT1203 exhibits excellent solder resistance, and the dip soldering area is up to 90%.


3. Good adhesion

The tantalum capacitor using silver paste DT1203 is with good adhesion. Stick the printing surface with 3M tape and then quickly vertically pulled off, no Ag transfer.


4. Good Hardness

Test the hardness of a standard line with a pencil hardness tester, the hardness of silver paste DT1203 is equal to or greater than 2H. It presents good hardness property of the silver paste.


5. Good printing properties

The paste is with proper viscosity, good thixotropy and levelling properties which enables excellent printing properties. After screen printing, the film is well-distributed, fine and smooth.


6. Environmental friendly, up to RoHS regulation

The low temperature silver paste contains no toxic materials and heavy metal ions such as lead, Cadmium, nickel, and it is environmental friendly and meet environmental standard of RoHS regulation

Contact Details
Hunan LEED Electronic Ink Co., Ltd

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