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Tantalum Capacitor Low Temperature Silver Paste 100 - 200℃ Curing Temperature

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Tantalum Capacitor Low Temperature Silver Paste 100 - 200℃ Curing Temperature

China Tantalum Capacitor Low Temperature Silver Paste 100 - 200℃ Curing Temperature supplier

Large Image :  Tantalum Capacitor Low Temperature Silver Paste 100 - 200℃ Curing Temperature

Product Details:

Place of Origin: China
Brand Name: LEED-INK
Certification: ISO9001, ISO14001, SGS, ROHS
Model Number: DT1203

Payment & Shipping Terms:

Minimum Order Quantity: 1KG
Price: Negotiable
Packaging Details: 1KG/ Plastic Jar, 6 Jars/ Carton. Carton size: 39*26*17cm. G.W.: 7.5KG/ Carton
Delivery Time: Within 7 days after payment confirmed
Payment Terms: L/C, T/T, Western Union, Paypal
Detailed Product Description
Viscosity: 0.5-10Pa.S Solid Content (%): 58-68
Drying: 130℃/30min + 180℃/30min Adhesion/ Tape Pull (3M Scotch Tape #600): No Ag Transfer
Pencil Hardness(H): ≥2 Solderability: Dip Soldering Area: >90%
Dip Soldering Condition: Sn92 Ag 3.5cu0.5 (230℃-240℃, 1-5min) Volume Resistivity: <2.4×10-4Ω·cm

 

High Electrically Conductivity Low Temperature Silver Paste for Tantalum Electrolytic Capacitors

 

 

Description

 

LEED-INK silver conductive paste DT1203 is a general purpose coating suitable for direct application to most substrates including plastics and it is special suitable for tantalum capacitors applications. It is non-toxic element up to European RoHS environmental regulation (2002/95/EC). It has features of high electrically conductivity, low consumption, high heat-resistance, etc.

 

Application

 

The low temperature curing conductive silver paste refers to the silver paste with curing temperature of 100-200℃. The silver paste DT1203 is mainly developed for capacitors including tantalum electrolytic capacitors and aluminum electrolytic capacitors.

It is designed to exhibit good adhesion and low consumption purposes.

 

Specification

 

Test Properties

Viscosity (Pa.S)

(10rpm, 25℃, 2min)

0.5-10
Solid Content 63±5%
Drying Temperature & Time 130℃/30min + 180℃/30min
Dip Soldering Condition

Sn92 Ag 3.5cu0.5

230℃-240℃ 1-5min

Solderability Dip Soldering Area: >90%
Volume Resistivity <2.4×10-4Ω·cm
Adhesion 3M #600 Tape *1min, vertical pull, no Ag Transfer
Hardness ≥2H
Shelf Life

Six Months

from Date of Shipment

 

Feature Advantage

 

1. High Electronic Conductivity

The low temperature curing silver paste is with high electrical conductivity, and the volume resistance could be controlled under 2.4×10-4Ω·cm.

 

2. Low heat-drying temperature

The low temperature curing conductive silver paste refers to the silver paste with drying temperature of 100-200℃. And LEED-INK silver paste DT1203 is suggested drying process of 130℃/30min plus 180℃/30min.

 

3. Good adhesion

The tantalum capacitor using silver paste DT1203 is with good adhesion. Stick the printing surface with 3M tape and then quickly vertically pulled off, no Ag transfer.

 

4. Good Hardness

Test the hardness of a standard line with a pencil hardness tester, the hardness of silver paste DT1203 is equal to or greater than 2H. It presents good hardness property of the silver paste.

 

5. High Cost Efficient

the low temperature silver paste DT1203 is specially developed for low temperature curing applications. By years of improvement, we are keeping develop and reduced the noble metal content to reduce the cost and provide most cost efficient materials to the market.

Contact Details
Hunan LEED Electronic Ink Co., Ltd

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