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Low Bow Solar Cell Paste Back Side Aluminum Paste 30mΩ/Sq Resistivity

Good quality Solar Cell Paste for sales
Good quality Solar Cell Paste for sales
The company considerate after-sales service ,And try their best to meet the requirement of customers. We will be a long-term cooperation.

—— Mr. Tehrani

Very appreciate for your professional service & higher standard quality control,very happy to work with LEED!

—— Ronaldo

We trust the quality of your products. It always the best. Keep this going, and we will establish a long-term trade relationship with you.

—— Mr. Mac Cameron

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Low Bow Solar Cell Paste Back Side Aluminum Paste 30mΩ/Sq Resistivity

China Low Bow Solar Cell Paste Back Side Aluminum Paste 30mΩ/Sq Resistivity supplier

Large Image :  Low Bow Solar Cell Paste Back Side Aluminum Paste 30mΩ/Sq Resistivity

Product Details:

Place of Origin: China
Brand Name: LEED-INK
Certification: CE, SGS, RoHS, ISO9001, ISO14001
Model Number: BL01A

Payment & Shipping Terms:

Minimum Order Quantity: 1KG
Price: Negoatiable
Packaging Details: 1KG/Plastic Jar, 6 Jars/ Carton. Carton size: 39*26*17cm. G.W.:7.5KG/ Carton.
Delivery Time: Within 7 days after payment confirm
Payment Terms: L/C, T/T, Western Union
Supply Ability: 300000KG per month
Detailed Product Description
Solid Content (%): 70-80 Viscosity (Pa.S): 40-120
Fineness(μm): ≤22 Peak Temperature: 770-830℃
Wet Deposit (g/pcs) (156*156): 1.24-1.4 Resistivity (mΩ/sq): ≤30
Bow: Monocrystal Silicon: ≤2.0mm; Polysilicon:≤1.8mm Eff.: Monocrystal Silicon: ≥19.50; Polysilicon:≥18.50

Low Bow and Good Adhesion PV Solar Cell Back Side Aluminum Paste   BL01A Series

 

Description
BL01A series is environmental aluminum paste developed to provide back contact metallization for solar cell, to match with the TEC of silicon substrate well.

 

Benefits

  • Low Warpage
  • Low consumption
  • Good Adhesion
  • Good Printing Resolution
  •  High Photoelectrical Conversion Efficiency
  •  Fine and smooth print surface

 

Typical Properties

 

Test Properties
Solid Content (%) 70-80

Viscosity (Pa.S)

(NDJ-8S, #4, 25±0.5℃)

40-120
Fineness(μm) ≤22

Recommended

Drying Conditions

Chain fast burning furnace:

280℃-350℃/25-50sec;

Rotating drying furnace:

180℃-250℃/8-15min

Practical

Peak Temperature

770-830℃

Wet Deposit (g/pcs)

(156*156)

1.24-1.4

Resistivity (mΩ/sq)

(Fired Thickness)

≤30

Cell Warpage

(156 mono/polycrystal

silicon,180μm)

Monocrystal silicon: ≤2.0mm;

Polysilicon:≤1.8mm

Adhesion (N) (Single side EVA tape) >20
Photoelectrical Conversion Efficiency(%)

Monocrystal silicon: ≥19.50;

Polysilicon:≥18.50

Shelf Life Six Months from Date of Shipment

Contact Details
Hunan LEED Electronic Ink Co., Ltd

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