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Rapid Curing Electronic Potting Silicone , Adhesive Transformer Potting Compound

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Good quality Solar Cell Paste for sales
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Rapid Curing Electronic Potting Silicone , Adhesive Transformer Potting Compound

China Rapid Curing Electronic Potting Silicone , Adhesive Transformer Potting Compound supplier

Large Image :  Rapid Curing Electronic Potting Silicone , Adhesive Transformer Potting Compound

Product Details:

Place of Origin: China
Brand Name: LEED-INK
Certification: ISO9001, ISO14001, SGS, ROHS
Model Number: EG-F series

Payment & Shipping Terms:

Minimum Order Quantity: 1KG
Price: Negotiable
Packaging Details: 1KG/Plastic can, 5KGS/Plastic bucket, and 25KGS/Plastic bucket
Delivery Time: within 7 days after payment confirmed
Payment Terms: L/C, T/T, Western Union, Paypal
Supply Ability: 500000KG per month
Detailed Product Description
Mixing Ratio: 1:1 Color: Red Or Gray
Heating Curing Time (h): 100℃/15min Operating Temperature (℃): -50℃-250℃
Thermal Conductivity (W/m.K): 0.8-2.6

Silicone Encapsulants   EG-F026R | EG-F008G

 

 

Description

 

LEED-INK silicone encapsulant is a two-components room curing silicone thermal conductivity encapsulant. It is designed for long-term protection of precision electronic equipment and components in electronic industry. It is especially suitable for the sealing of electronic circuit boards and components in bad environment(such as moisture, shock and corrosive place, etc.) and the heat dissipation of high power components.

 

 

Benefits

  • High thermal conductivity, high and low temperature resistance(-50℃-250℃)
  • Rapid curing time, and the curing time is adjustable
  • Good adhesivity with materials such as metal, plastics,etc.

 

Rapid Curing Electronic Potting Silicone , Adhesive Transformer Potting CompoundRapid Curing Electronic Potting Silicone , Adhesive Transformer Potting Compound

 

 

Typical Properties

 

Test Properties
EG-F026R EG-F008G
Mixing Ratio 1:1 1:1
Color A B A+B A B A+B
White Red Red White Black Gray

Viscosity (Pa.S)

(Brookfield HBT,10rpm,25℃)

80 40 60 3.5 4 4

Room Temperature

Operable Time (h)

>8h >4h

Room Temperature

Curing Time (h)

24 24
Heating Curing Time (h) 100℃/15min 100℃/15min
Density (g/cm3) 2.54 1.50
Hardness (shore A) 60 42
Operating Temperature (℃) -50℃-250℃ -50℃-250℃
Thermal Conductivity (W/m.K) 2.60 0.80
Volume Resistance (Ω·cm) 1014 1014

 

 

Applications

 

The silicone encapsulant is applied to the sealing and heat dissipation of the electronic circuit board and components, to achieve insulation, moisture and shock proof.

 

 

Usage

 

1) Component A and component B should use special tools separately. Do not use the tools in mixture.

2) Separately stir component A and component B fully and evenly before using.

3) Mix according to A:B=1:1, and stir it over 15min to ensure the mixing uniformity of component A and B.

4) After mixing, deaerate the paste in vacuum equipment with 10min before potting. To ensure the potting quality, it is recommended to deaerate again after potting. If no deaeration, please put the product with 30min in room temperature before heating and curing.

5) Please finish 3) and 4) within operating time(8h).

6) Curing could be done by 80℃/15min, or 24h in room temperature.

 

 

Notice

 

During storage and using process, please avoid contact with inorganic substances which includes nitrogen, phosphorus, sulfur, tin, lead and others. Otherwise the catalyst in the product would be lose efficacy without sulfuration.

Please put the products in dry and cool places. Do not mix component A and component B during storage.

 

 

Delivery and Storage

 

During transportation and storage should protect against the tide and contamination. Containers may be stored in a cool dark, dry and stable environment at room temperature, with their lids tightly sealed. The shelf life of the paste is 12 months. The used material should be collected and sealed up alone. Don’t mix with other untapped material. Pay attention to prevent moisture and impurities infiltration.

 

 

Package

 

The general package is 1KG/Plastic can, 5KGS/Plastic bucket, and 25KGS/Plastic bucket.

Contact Details
Hunan LEED Electronic Ink Co., Ltd

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